Spin Scrubber
The autonomous single scrubber tool uses DIW to provide highest particle control capabilities.
MAIN FEATURES
Maximum flexibility and fast installation from a modular design
Optimized footprint
Wide spectrum of customization and expansion options:
Available as a classic manual wet processor with a fume hood to provide higher safety standards;
Different material designs available;
Cost-effective PP including FM 4910
WAFER SIZE UP TO 12″ (300 mm)
SUBSTRATES
Wafers, MEMS, optoelectronics, photomasks, glass substrates
MATERIAL CONFIGURATION
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
SPIN SCRUBBER PROCESSES
– SC1 , SC2
– HF, BOE, HCl, HF/HNO3, DSP
– Solvent
– Others on request
IMPORTANT TECHNICAL FEATURES
– Maximum flexibility from a modular design
– Precise flow control
– Backside cleaning system
– Effective DIW-rinse with optional high-pressure nozzle
– Device protection with Bernoulli chuck (option)
– Various cleaning system: sonic, nano spray, brush
