Spin Scrubber

The autonomous single scrubber tool uses DIW to provide highest particle control capabilities.

MAIN FEATURES

  • Maximum flexibility and fast installation from a modular design

  • Optimized footprint

  • Wide spectrum of customization and expansion options:

  • Available as a classic manual wet processor with a fume hood to provide higher safety standards;

  • Different material designs available;

  • Cost-effective PP including FM 4910

WAFER SIZE UP TO 12″ (300 mm)

SUBSTRATES

Wafers, MEMS, optoelectronics, photomasks, glass substrates

MATERIAL CONFIGURATION

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz


SPIN SCRUBBER PROCESSES

– SC1 , SC2
– HF, BOE, HCl, HF/HNO3, DSP
– Solvent
– Others on request


IMPORTANT TECHNICAL FEATURES

– Maximum flexibility from a modular design
– Precise flow control
– Backside cleaning system
– Effective DIW-rinse with optional high-pressure nozzle
– Device protection with Bernoulli chuck (option)
– Various cleaning system: sonic, nano spray, brush

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