Manual Wet Station
NEXTATION Manual is an advanced manual wet station that provides versatile process capabilities on an efficiently small footprint and covers up to 300 mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals.
MAIN FEATURES
Maximum flexibility and fast installation from a modular design
Small footprint
Available customized specifications
Higher safety standards (FM, CE/SEMI Certification)
Varied dryer options (Spin, Marangoni)
Varied PP materials including FM 4910
Fume-free (Individual auto exhaust)
Improved concentration stability
Easy maintenance
WAFER SIZE UP TO 12″ (300 mm)
SUBSTRATES
Wafers, MEMS, optoelectronics, photomasks, glass substrates
MATERIAL CONFIGURATION
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
CHEMICAL WET PROCESSES
– SC1 , SC2
– HF, BOE, HCl, HF/HNO3
– KOH, TMAH
– SPM, H3PO4,
– Solvent
– Others on request
IMPORTANT TECHNICAL FEATURES
– Recirculation capability
– Precise flow control
– IPA process at room temperature
– Megasonic at 1,000 KHz (other frequencies possible)
– Parts materials safe from chemical damages
– Available options: DI/N2 spray gun, FM4910, N2 bubbling, agitation, premix tanks
Auto Wet Station
NEXTATION Auto provides versatile process capabilities with particle control on a nano-scale, built on an efficiently small footprint and covers up to 300 mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals.
MAIN FEATURES
Maximum flexibility and fast installation from a modular design
Small footprint
Available customized specifications
Higher safety standards (FM, CE/SEMI Certification)
Varied dryer options (Spin, Marangoni)
Varied bath types
Varied PP materials including FM 4910
Fume-free (exhausts are separated by individual chemical zones and automatically controlled)
Improved minimal wafer contact
Improved concentration stability
Easy maintenance
WAFER SIZE UP TO 12″ (300 mm)
SUBSTRATES
Wafers, MEMS, optoelectronics, photomasks, glass substrates
MATERIAL CONFIGURATION
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
CHEMICAL WET PROCESSES
– SC1 , SC2
– HF, BOE, HCl, HF/HNO3
– KOH, TMAH
– SPM, H3PO4,
– Solvent
– Others on request
IMPORTANT TECHNICAL FEATURES
– Recirculation capability
– Precise flow control
– Ultrasonic at 40/80/120/250/500 KHz
– Megasonic at 1,000 KHz (other frequencies possible)
– Parts materials safe from chemical damages
– Available options: DI/N2 spray gun, FM4910, N2 bubbling, agitation, premix tanks.
