Manual Wet Station

NEXTATION Manual is an advanced manual wet station that provides versatile process capabilities on an efficiently small footprint and covers up to 300 mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals.

MAIN FEATURES

  • Maximum flexibility and fast installation from a modular design

  • Small footprint

  • Available customized specifications

  • Higher safety standards (FM, CE/SEMI Certification)

  • Varied dryer options (Spin, Marangoni)

  • Varied PP materials including FM 4910

  • Fume-free (Individual auto exhaust)

  • Improved concentration stability

  • Easy maintenance

WAFER SIZE UP TO 12″ (300 mm)

SUBSTRATES

Wafers, MEMS, optoelectronics, photomasks, glass substrates

MATERIAL CONFIGURATION

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz

CHEMICAL WET PROCESSES

– SC1 , SC2
– HF, BOE, HCl, HF/HNO3
– KOH, TMAH
– SPM, H3PO4,
– Solvent
– Others on request

IMPORTANT TECHNICAL FEATURES

– Recirculation capability
– Precise flow control
– IPA process at room temperature
– Megasonic at 1,000 KHz (other frequencies possible)
– Parts materials safe from chemical damages
– Available options: DI/N2 spray gun, FM4910, N2 bubbling, agitation, premix tanks

Auto Wet Station

NEXTATION Auto provides versatile process capabilities with particle control on a nano-scale, built on an efficiently small footprint and covers up to 300 mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals.

MAIN FEATURES

  • Maximum flexibility and fast installation from a modular design

  • Small footprint

  • Available customized specifications

  • Higher safety standards (FM, CE/SEMI Certification)

  • Varied dryer options (Spin, Marangoni)

  • Varied bath types

  • Varied PP materials including FM 4910

  • Fume-free (exhausts are separated by individual chemical zones and automatically controlled)

  • Improved minimal wafer contact

  • Improved concentration stability

  • Easy maintenance

WAFER SIZE UP TO 12″ (300 mm)

SUBSTRATES

Wafers, MEMS, optoelectronics, photomasks, glass substrates

MATERIAL CONFIGURATION

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz

CHEMICAL WET PROCESSES

– SC1 , SC2
– HF, BOE, HCl, HF/HNO3
– KOH, TMAH
– SPM, H3PO4,
– Solvent
– Others on request

IMPORTANT TECHNICAL FEATURES

– Recirculation capability
– Precise flow control
– Ultrasonic at 40/80/120/250/500 KHz
– Megasonic at 1,000 KHz (other frequencies possible)
– Parts materials safe from chemical damages
– Available options: DI/N2 spray gun, FM4910, N2 bubbling, agitation, premix tanks.

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