Lift-up Dryer

NEO series lift-up dryer is a most advanced Marangoni drying apparatus capable of efficient particle control on a nano-scale.

MAIN FEATURES

  • Ultimate drying performance with lowest particle counts

  • Shortest process time

  • Optimized small footprint

  • Proven quality from over 20 years of field operations

  • Excellent equipment compatibility with various wet station models

WAFER SIZE UP TO 12″ (300 mm)

SUBSTRATES

Wafers, MEMS, optoelectronics, photomasks, glass substrates

MATERIAL CONFIGURATION

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz

DRY PROCESSES

– RD: DIW Overflow + Dry
– FRD: DHF + DIW Overflow + Dry

IMPORTANT TECHNICAL FEATURES

– IPA processes at room temperature
– Precise flow control
– Parts materials safe from chemical damages
– One-way stream
– Watermark-free
– Dome-shaped multi-tasking chamber

Swing Dryer

Swing Dryer is a most advanced and efficient cassette-type Marangoni drying apparatus.

MAIN FEATURES

  • Optimized small footprint

  • Proven quality from over 20 years of field operations

  • No broken wafers during process

  • Excellent equipment compatibility with various wet station models

WAFER SIZE UP TO 12″ (300 mm)

SUBSTRATES

Wafers, MEMS, optoelectronics, photomasks, glass substrates

MATERIAL CONFIGURATION

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz

DRY PROCESSES

– RD: DIW Overflow + Dry

IMPORTANT TECHNICAL FEATURES

– Precise flow control
– Parts materials safe from chemical damages
– One-way stream
– Watermark-free
– Dome-shaped multi-tasking chamber
– Thin wafer process
– Hot N2 Nozzle

FRD Dryer

FRD Dryer is an advanced drying apparatus with DHF etching and Rinse & Dry functionalities that allows effective particle control on a nano-scale and covers up to 300 mm in wafer size.

MAIN FEATURES

  • Highest drying performance

  • Short process time

  • Optimized small footprint

  • Proven quality from over 20 years of field operations

  • Excellent equipment compatibility with various wet station models

WAFER SIZE UP TO 12″ (300 mm)

SUBSTRATES

Wafers, MEMS, optoelectronics, photomasks, glass substrates

MATERIAL CONFIGURATION

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz

CHEMICAL WET PROCESSES

– DHF etching
– DIW Overflow + Dry
– Others on request

IMPORTANT TECHNICAL FEATURES

– IPA & DHF processes at room temperature
– Precise flow control
– Parts materials safe from chemical damages
– One-way stream
– Watermark-free
– Dome-shaped multi-tasking chamber

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