Lift-up Dryer
NEO series lift-up dryer is a most advanced Marangoni drying apparatus capable of efficient particle control on a nano-scale.
MAIN FEATURES
Ultimate drying performance with lowest particle counts
Shortest process time
Optimized small footprint
Proven quality from over 20 years of field operations
Excellent equipment compatibility with various wet station models
WAFER SIZE UP TO 12″ (300 mm)
SUBSTRATES
Wafers, MEMS, optoelectronics, photomasks, glass substrates
MATERIAL CONFIGURATION
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
DRY PROCESSES
– RD: DIW Overflow + Dry
– FRD: DHF + DIW Overflow + Dry
IMPORTANT TECHNICAL FEATURES
– IPA processes at room temperature
– Precise flow control
– Parts materials safe from chemical damages
– One-way stream
– Watermark-free
– Dome-shaped multi-tasking chamber
Swing Dryer
Swing Dryer is a most advanced and efficient cassette-type Marangoni drying apparatus.
MAIN FEATURES
Optimized small footprint
Proven quality from over 20 years of field operations
No broken wafers during process
Excellent equipment compatibility with various wet station models
WAFER SIZE UP TO 12″ (300 mm)
SUBSTRATES
Wafers, MEMS, optoelectronics, photomasks, glass substrates
MATERIAL CONFIGURATION
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
DRY PROCESSES
– RD: DIW Overflow + Dry
IMPORTANT TECHNICAL FEATURES
– Precise flow control
– Parts materials safe from chemical damages
– One-way stream
– Watermark-free
– Dome-shaped multi-tasking chamber
– Thin wafer process
– Hot N2 Nozzle
FRD Dryer
FRD Dryer is an advanced drying apparatus with DHF etching and Rinse & Dry functionalities that allows effective particle control on a nano-scale and covers up to 300 mm in wafer size.
MAIN FEATURES
Highest drying performance
Short process time
Optimized small footprint
Proven quality from over 20 years of field operations
Excellent equipment compatibility with various wet station models
WAFER SIZE UP TO 12″ (300 mm)
SUBSTRATES
Wafers, MEMS, optoelectronics, photomasks, glass substrates
MATERIAL CONFIGURATION
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
CHEMICAL WET PROCESSES
– DHF etching
– DIW Overflow + Dry
– Others on request
IMPORTANT TECHNICAL FEATURES
– IPA & DHF processes at room temperature
– Precise flow control
– Parts materials safe from chemical damages
– One-way stream
– Watermark-free
– Dome-shaped multi-tasking chamber
