Single Wafer Process

SPINEL single wafer process tool provides versatile autonomous process capabilities with particle control on a nano-scale, built on an efficiently small footprint and covers up to 300 mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals.


MAIN FEATURES

  • Low chemical and wafer consumptions

  • Small footprint

  • 3-layer stacking

  • Maximum performance achieved through optimized robot and process calibration

  • Higher safety standards (FM, CE/SEMI Certification)

  • Improved minimal wafer contact

  • Improved chemical control stability

  • Improved exhaust pressure control stability

  • Improved cup layer control by servo motor

  • Easy maintenance


WAFER SIZE UP TO 12″ (300 mm)


SUBSTRATES

Wafers, MEMS, optoelectronics, photomasks, glass substrates


MATERIAL CONFIGURATION

Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz


CHEMICAL WET PROCESSES

– SC1 , SC2
– HF, BOE, HCl, HF/HNO3, DSP
– Solvent
– Others on request


IMPORTANT TECHNICAL FEATURES

– Maximum flexibility from a modular design
– Precise flow control
– Improved etching uniformity
– Fume-free (exhausts are separated by individual chemical zones and automatically controlled)
– Process chamber cleaning system
– Reduced costs from chemical recycle system
– Device protection with Bernoulli chuck (option)
– Various cleaning system: sonic, nano-spray, brush

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