Single Wafer Process
SPINEL single wafer process tool provides versatile autonomous process capabilities with particle control on a nano-scale, built on an efficiently small footprint and covers up to 300 mm in wafer size, thin wafers, ICS, MEMS, LED, photo masks and glass substrates that use various process chemicals.
MAIN FEATURES
Low chemical and wafer consumptions
Small footprint
3-layer stacking
Maximum performance achieved through optimized robot and process calibration
Higher safety standards (FM, CE/SEMI Certification)
Improved minimal wafer contact
Improved chemical control stability
Improved exhaust pressure control stability
Improved cup layer control by servo motor
Easy maintenance
WAFER SIZE UP TO 12″ (300 mm)
SUBSTRATES
Wafers, MEMS, optoelectronics, photomasks, glass substrates
MATERIAL CONFIGURATION
Si, SiC, GaN, GaAs, Sapphire, Glass, Quartz
CHEMICAL WET PROCESSES
– SC1 , SC2
– HF, BOE, HCl, HF/HNO3, DSP
– Solvent
– Others on request
IMPORTANT TECHNICAL FEATURES
– Maximum flexibility from a modular design
– Precise flow control
– Improved etching uniformity
– Fume-free (exhausts are separated by individual chemical zones and automatically controlled)
– Process chamber cleaning system
– Reduced costs from chemical recycle system
– Device protection with Bernoulli chuck (option)
– Various cleaning system: sonic, nano-spray, brush
